4:00 PM - 4:30 PM

Expanding Applications of Dielectric Cure Monitoring



Dielectric cure monitoring is the only mature testing method that allows users to obtain critical data on curing thermosets in situ, in real time, over the course of the entire cure. Dielectric cure monitoring, also known as Dielectric Analysis (DEA) can accelerate R&D processes by eliminating the need for more time-consuming and less accurate forms of testing. It can also speed the transition from R&D to quality control and quality assurance by providing QA/QC teams with solid data upon which they can base their work—helping to ensure the quality and reliability of the finished product.

In my talk, I will discuss how DEA can be applied across a range of materials and applications relevant to resin formulation in R&D, outgoing product testing in QA/QC, and cure monitoring in manufacturing. The insights obtained through this technique are applicable in products ranging from nail polish and countertops to aerospace structures, automotive and marine parts, and wind turbine blades.


Huan Lee is an electronics engineer with more than 30 years experience designing instrumentation for the composites industry. He has graduate degrees from the Massachusetts Institute of Technology, where he was part of a research group that worked on dielectric cure monitoring. He is also a co-founder of Micromet Instruments, which first commercialized the technology developed at MIT.

In 2008 he co-founded Lambient Technologies LLC with Stephen Pomeroy to advance the use of dielectric cure monitoring for thermosets and composites.

PRESENTATION: Expanding Applications of Dielectric Cure Monitoring

Huan Lee / Co-Founder, Lambient Technologies